bond wire

The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account.

分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。

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In addition, some specimens are annealed at a high temperature for 500 hrs in order to investigate the effect of thermal aging on wire bond reliability.

另外，为了研究热老化对焊点可靠性的影响，一些样品被放置在恒温炉中储存500小时。

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Bond and Life Bond strength and splice zone of welded wire fabric in reinforced concrete slabs

焊接钢筋网在混凝土板中的粘结和搭接长度

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When the aging time is 40 d, the cloud-like structure transforms into rectangular island-like structure and there are many cavities inside the bond wire, which are different from the Kirkendall voids because of the shape and dimension.

老化40d时，引线内部出现大量的孔洞并存在方块岛状的Al-Ni组织，其尺寸和形状显示与Kirkendall孔洞不同。

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Including Bond Wire and Pad effects both, detailed performances have also been proposed with NF deterioration to 3.21/3.23 dB, but S parameters change a little after tuning and optimization, finally, the circuit turns out to have outstanding performances.

完全考虑Bond Wire和Pad效应的性能参数也已经给出，但噪声系数恶化为3.21/3.23dB，S参数在电路调整优化之后变化不大，整体性能比较突出。

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Faster manufacturing through-put than wire bond for high pin-count chips.

对于高密度引脚芯片,生产效率高于丝键合.

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Check the Quality of Package Strictly to Improve the Wire Bond Reliability of SAW Device

加强管壳检验工作，提高SAW器件的键合可靠性

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Better manufacturing yield than wire bond for high pin-count chips.

对于高密度引脚芯片,成品率优于丝键合.

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Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

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